HomeNewsQualcomm Snapdragon 670 chipset specs leak ahead of official launch

Qualcomm Snapdragon 670 chipset specs leak ahead of official launch

Qualcomm is testing the latest chipset on a prototype device.

Qualcomm is reportedly working on the next-generation of Snapdragon mid-range chipset. Dubbed as Snapdragon 670, some key specs of the upcoming processor has been leaked spilling some important information.

According to a leak by Roland Quandt, Qualcomm is testing the latest chipset on a prototype device. He says that the upcoming chipset will support WQHD screens and it will support up to 6GB of LPDDR4X RAM. The upcoming chipset will also support up to 64GB of eMMC 5.1 flash storage.

On the camera front, the chipset could support up to a 22.6-megapixel rear camera and up to 13-megapixel front-facing camera. However, the value could be greater with the finalized chipset. It is reported that the Snapdragon 670 will be manufactured using Samsung’s 10nm LPP processor, which is found in Qualcomm Snapdragon 835 and Samsung Exynos 8895 processors.

Some reports suggest that the upcoming Snapdragon 670 would feature a similar octa-core chipset, which is found in its predecessor, the Snapdragon 660. This means it comes loaded with eight Kryo 260 cores with two high-performance cores. Multiple reports suggest that the company could unveil the processor by the Q1 of 2018.

Earlier this month, Qualcomm announced its latest flagship Snapdragon 845 mobile platform. With the Snapdragon 845 mobile platform, the company is heavily banking on the AI, camera, faster performance, among others. For this, the brand has developed a new Qualcomm Hexagon 685 DSP architecture with GPU and CPU enhancements for faster processing of neural networks. The platform will allow more information to be processed locally, which will result in better latency, reliability and security. The AI platform supports popular frameworks such as Google TensorFlow and Facebook Caffe2.

Moving to the performance, the latest Snapdragon 845 processor uses eight cores with ARM A75 and ARM A55 cores. The four high-performance A75 cores will run at a clock speed of up to 2.8GHz, while the four power-efficient A55 cores will run at a speed of up to 1.8GHz. The chipset also features new Qualcomm Adreno 630 visual processing subsystem that features room-scale 6DoF with SLAM, Adreno Foveation, and it offers a 30 percent improvement in graphics/video rendering compared to the previous generation.

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Coming to the camera performance, the Qualcomm Snapdragon 845 comes loaded with Qualcomm Spectra 280 ISP, which it claims can capture 64 times more shades of colour information than our previous generation Snapdragon 835. The chipset will support up to 16-megapixel dual cameras and up to 32-megapixel single camera setup with hybrid autofocus, multi-frame noise reduction, HDR video recording and more. It will also allow shooting 4K videos at 60 frames per second and it also supports single-camera bokeh effect, similar to what we have seen in Google Pixel 2 series.

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