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Sony Xperia XZ1 Premium, XZ1 Plus with Snapdragon 845 chipset to be unveiled at MWC 2018: Report

By: Rohan Pal, The Mobile Indian, New Delhi Last updated : January 08, 2018 11:55 am

The company is planning to showcase the Xperia XZ1 Premium, Xperia XZ1 Plus and Xperia XZ1s during the MWC 2018 event.
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Sony will hold a press conference at the Consumer Electronics Show (CES) 2018, where it will unveil its next-generation of products. However, if a new report is believed to be true then the company might introduce its flagship lineup during the Mobile World Congress (MWC) 2018.

 

According to a Georgian website, Voretx.ge, the company is planning to showcase the Xperia XZ1 Premium, Xperia XZ1 Plus and Xperia XZ1s during the MWC 2018 event. The website also reveals some key specifications of the upcoming devices as well.

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To start with Xperia XZ1 Premium, the smartphone will feature a 5.46-inch 4K HDR LCD display and it will be powered by the latest Qualcomm Snapdragon 845 chipset. The device will be backed by a 6GB of RAM and 128GB of internal storage. On the camera front, it will feature a dual-camera setup with a combination of two 12-megapixel sensors. For the front, there will be a 13-megapixel shooter. The report highlights that the device will come with a rear-mounted fingerprint sensor.

 

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The Xperia XZ1 Plus and Xperia XZ1s will come loaded with 5.5-inch FHD HDR LCD display and 5.2-inch Full HD display respectively. Both the smartphones will be powered by the Qualcomm Snapdragon 835 chipset. The devices will be backed by a 4GB of RAM and 64GB of internal storage. On the camera front, both of them will feature a dual-camera setup with a combination of two 12-megapixel sensors. For the front, there will be a 13-megapixel shooter. The report highlights that the devices will come with a rear-mounted fingerprint sensor.

 

If this is true then Sony could launch its mid-range smartphones including Xperia XA2, Xperia XA2 Ultra and Xperia L2 during the CES 2018. The smartphones were recently leaked online revealing all the specs and design.

 

Note: Image is for representational purpose only

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