HomeNewsMediaTek Dimensity 7200 SoC announced: Check details

MediaTek Dimensity 7200 SoC announced: Check details

MediaTek has unveiled a new chipset called Dimensity 7200 that would power the 5G mid-rangers in Q1 2023.


  • MediaTek Dimensity 7200 has been announced
  • MediaTek Dimensity 7200 SoC supports 200MP main camera
  • MediaTek Dimensity 7200 will power 5G devices in Q1 2023

MediaTek has announced a new called the Dimensity 7200 which based on the TSMC 4nm process. It comes with MediaTek HyperEngine 5.0 technology and has MediaTek’s built-in Processing Unit (APU) to maximise the efficiency of AI tasks and AI-fusion processing. Read on to know more about the new chipset.

MediaTek Dimensity 7200 Specifications

The Dimensity 7200 delivers the same TSMC 4nm second-generation process found in the Dimensity 9200. The octa-core integrates two Arm Cortex-A715 cores, featuring operating speeds of up to 2.8GHz, with six Cortex-A510 cores. To further optimise power and performance, MediaTek’s built-in AI Processing Unit (APU) maximises the efficiency of AI tasks and AI-fusion processing.

For gamers, the MediaTek HyperEngine 5.0 technology delivers AI-based Variable Rate Shading (VRS) for power savings, CPU and smart resource optimization for better battery life, and other upgrades for smooth gameplay. The chipset also integrates an ARM Mali G610 GPU.

It can utilise MediaTek’s Imagiq 765 and a 14-bit HDR-ISP and supports 200MP main cameras for epic photography. The chipset enables video capturing with HDR video, and even allows users to simultaneously capture content from two cameras at Full HD resolution while keeping everything in focus with all-pixel technology.

To ensure users can capture imagery clearly at night and in low-light environments, the chipset has built-in motion compensated noise reduction. Additionally, the APU supports powerful AI-Camera enhancements such as real-time portrait beautification.

Dimensity 7200 has a 3GPP Release-16 standard Sub-6GHz modem with up to 4.7Gbps downlink, and supports triband Wi-Fi 6E connectivity and next-gen 5.3. The fully integrated 5G modem and MediaTek’s 5G UltraSave 2.0 technology suite ensure cellular power efficiency. For reliable coverage everywhere, the chipset supports 2CC Carrier Aggregation and Dual 5G SIM with dual VoNR. The Dual SIM capability also lets users have two connections, making it easy to take work and personal calls from a single smartphone.

The chipset supports up to Full and 144Hz refresh rate, MediaTek MiraVision Display with HDR supports the latest standards including HDR10+, CUVA HDR and Dolby HDR, AI SDR-to-HDR video playback, and Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio for wireless earbud support.

As for availability, MediaTek says that the Dimensity 7200 will power 5G devices launching in the global market in Q1 2023. In related news to MediaTek, the brand recently also unveiled its entry level chipset called MediaTek Helio G36 which is based on TSMC’s 12nm process and comprises of eight Cortex-A53 cores clocked at 2.2GHz. There is an IMG PowerVR GE8320 GPU onboard. It supports FHD+ displays with up to 90Hz refresh rate.

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