Xiaomi Mi 6 Plus smartphone was rumoured to launch alongside Xiaomi’s flagship device Mi 6 which was launched in April this year, but all speculations put to rest when the company only launched Mi 6 flagship device in China.
The Xiaomi Mi 6 Plus smartphone later got the necessary 3C certification with model number MDE40. Further, we might have the first look at the design as a back cover for Mi 6 has now been leaked online, as per a report of GizChina. The case reveals that Mi 6 Plus will have a larger screen size than the Xiaomi Mi 6 and it will not have a 3.5 mm audio jack. As per rumours, the Mi 6 Plus is expected to be unveiled sometime in summers.
As far as expected specifications of Xiaomi Mi6 Plus are concerned, it is said to feature larger 5.7-inch full HD display with a resolution of 1920 x 1080 pixels and will have 6GB of RAM with 64GB/128GB of Internal storage. The smartphone will get its strength from a powerful 4,500mAh battery and will come loaded with Android 7.0 Nougat based on MIUI 8.
On the camera front, the smartphone is expected to feature dual-camera setup with both sporting a 12-megapixel Sony IMX362 sensor, while for the front, there will be an 8-megapixel ultra pixel shooter for selfies and video chats. As per 3C certification site, the device will use 18W fast charger. The smartphone will be powered by the latest Qualcomm Snapdragon 835 processor along with Adreno 540 GPU. The device will have connectivity features like Bluetooth, GPS, NFC, WiFi, etc.