Samsung is working on a new mid-range chipset known as Exynos 7872, according to the latest leak coming out of China. The South Korean tech giant is reported to be working on an upcoming chipset that it will be manufactured using the 14nm FinFET LLP (low power plus) process.
The leak further mentions that the Exynos 7872 will feature six cores with four Cortex-A53 cores meant for power efficiencywhile remaining two Cortex-A73 cores will be meant for performance. However, the maximum clock frequencies are not known at the moment.
The upcoming SoC will come loaded with Mali-T830 MP2 GPU, which is found on the Exynos 7870 processor. The chipset is also reported to the first to include a full-integrated modem. The leak further reveals that the processor will provide up to 70 percent better performance and will be 30 percent less power hungry as compared to the other Samsung’s 28nm chips.
The chipset is reported to be launched in October this year, however, other details about the processor are grim at the moment. It is reported that next Galaxy C series might come loaded with the upcoming chipset. If the above-mentioned specifications are believed to true, then the upcoming mid-range processor will Samsung’s answer to the rest competition which includes Qualcomm Snapdragon 600 series and MediaTek Helio series.