Huawei’s chipset division, HiSilicon, is reportedly working on the next flagship-level chipset to give a stiff competition to Qualcomm Snapdragon 845 mobile platform. Dubbed, Kirin 980, key specs of the upcoming SoC has been leaked online.
According to a report from China, Huawei could introduce its latest chipset at the upcoming IFA 2018 show, which will take place in Berlin, Germany. The report further highlights that the latest chipset from HiSilicon will come loaded an octa-core setup. There will be four performance Cortex-A77 cores that will run at 2.8GHz, however, there will be four Cortex-A55 cores for efficiency.
Previous leaks reveal that the latest chipset will be built using 7nm FinFET technology by TSMC. The company will also add AI chip technology by Cambricorn that is expected to make the NPU (Neural Processing Unit) smoother and can bring up to 5 trillion calculations per watt.
Further, multiple reports also suggest that the HiSilicon will add a powerful GPU unit in the chipset as well. The new GPU is reported to be 1.5 times faster than the Adreno 630 that comes loaded in Qualcomm Snapdragon 845 mobile platform. The first smartphones to be powered by the latest chipset are reported to Huawei Mate 20 and Mate 20 Pro.
Meanwhile, Huawei introduced a new mid-range chipset, the Kirin 710, during an event in China. The latest processor is based on the 12nm process, meaning that it will offer better performance and will be more energy efficient. The company claims that the new chipset offers 75 per cent higher single-core performance as compared to the 659 chipset. For multi-core performance, the company claims it is 68 per cent higher than the 659.