Huawei is reported to be working on the next-generation of its HiSilicon processor, dubbed as Kirin 710. The chipset is all set to rival the recently-launched Qualcomm Snapdragon 710 mobile platform.
According to a report by DigiTimes, the Kirin 710 processor will be an upgrade to Kirin 659 CPU, which is present in most of Honor and Huawei smartphones. The report highlights that the upcoming processor will be based on Cortex A73 CPUs and it is being built using the 12nm process at Taiwan Semiconductor Manufacturing Company (TSMC). For reference, the latest Qualcomm Snapdragon 710 processor features Cortex A75 CPU and it is built using 10nm FinFET process.
Coming to the AI features, the new processor will come bundled with built-in discrete Neural Processing Unit (NPU) to perform certain artificial intelligence functionalities. The report also mentions that the first Huawei smartphone to be powered by the latest HiSilicon Kirin 710 processor will Huawei Nova 3.
The phone is codenamed as Paris and it is expected to launch in July this year. The phone will feature 19:5:9 full-screen display and it will support dual-camera setup as well. Further, the two models of the latest smartphones with model number PRA-AL00 and PRA-Tl00 has been verified for meeting 3C (China Compulsory Certification) standards, sources close to the development told the publication. Huawei is expected to ship over 140 million smartphones in 2018, with mid-tier models accounting for at least 50% of total shipments, the report further added.