Samsung is reportedly collaborating with Google to make high-end SoC ( system on Chip) for upcoming Pixel 8 and Pixel 8 Pro devices. Previous reports suggested that Samsung Foundry’s third-generation 4nm process node will manufacture the Google Tensor 3 chip, which is set to power the upcoming Pixel 8 and Pixel 8 Pro devices.
A recent report by PhoneArena, citing a tipster has suggested that the Tensor 3 could actually be a customised Samsung Exynos 2300 chipset, codenamed “Quadra”. Additionally, there have been hints about the specifications of the next-generation Exynos 2300 SoC.
The report further added that the Exynos 2300 is said to have a configuration of 1+4+4 which includes a high-performance Cortex-X3 core clocked at 3.09GHz, four performance cores (ARM Cortex-A715) running at 2.65GHz, and four efficiency cores (ARM Cortex-A510) with a clock speed of 2.10GHz. It is also expected to feature a Samsung Xclipse 930 graphics chip and a special core dedicated to optimizing One UI.
Google Pixel 8 pro
Recently first look of the Google Pixel 8 Pro that should be arriving later this year was leaked. The new leak shows that Pixel 8 Pro is still retaining the camera bar at the back but the overall design has changed. Now, all three lenses are integrated into a single oval area.
Leaked renders of the Pixel 8 Pro reveal a new sensor positioned below the flash, the exact purpose of which is unknown. It could either serve as a macro or depth sensor or possibly a completely new sensor technology. The phone will feature a centered punch-hole selfie camera and a flat panel, in contrast to the curved panel seen on the 7 Pro, with a screen size of approximately 6.7 inches. The device measures 162.6×76.5×8.7mm, and when accounting for the camera bump, the thickness is around 12mm.